Addiction science: a modern processor is out of how to do?

Although the picture is very aware of this group is Intels Core i7 to play their own ads ( We are here to Intel ® Core i7 example), but still to understand the production process of modern processors, a good way. Photo on the map is the first from the sand to the process of monocrystalline silicon.

Ordinary sand about 25% of silicon, is second only to oxygen in the earths crust the most common elements, mainly in the form of silica. These silicon purified through a number of steps, enough to make the quality of chips - one billion per silicon atom, the only other species in an atom. Finally, these high-purity silicon atoms into a huge crystal silicon (diameter 8 to 12 inches) and weighing up to 100 kg!

Next, the silicon block was a horizontal cut into thin film sheets, each one is a wafer. After these wafer after polishing, to form the raw materials to produce chips. The earliest because of the technical relationship between the wafer, the diameter of only about passport-size, and todays most advanced fabs are already dealing with a 12-inch wafer. The larger diameter wafers, cutting some of the less waste, and every chip is priced lower.

And then began to chip down the production of it! The entire wafer by a thin layer of special material cover, which is characterized by material when it is ultraviolet light reach the part of the solution will be dissolved into. So as long as the ultraviolet light through a radiation shielding circuit patterns on the wafer can be printed on the wafer and the shield to the same pattern. Shielding and wafer in the film between the magnifying glass, can be relatively large to reduce the shielding pattern according to the wafer after.

Back when that was part of the UV light will reach into soluble, so when the bubble as long as the wafer in solution, the part has been exposed to will be, are not only exposure to the elements. Left to the special protection of silicon material as a protective film in the next step etching, a protective film will not be part of the etching out. Finally, special materials and then washed off, it becomes the lines are carved into the silicon.

In addition to etching patterns, for the wafer, feed is a common step. Will not need to feed some of the same protection of special materials, and the remaining part of the high-speed ion bombardment, we can change the electrical properties of silicon, the formation of different components of the transistor. In the example map, green feed is part of the insulator pink, light blue is expected to add another part.

Mini transistor is completed, the final step is to up the entire transistor insulation, leaving only the future of the contact connected to other transistors. Way of making contact is to pre-copper plating to leave a good hole, and then worn away excess copper polishing.

The next step is to pull in between transistors thin copper wire. Which line from the company who design chips, but all in all is very complex. Although the chip surface is flat, but in fact as many as 20 layers of clothes line between the reduction in the transistor.

End of line drawing, the chip itself, the production is complete. Next is a simple test to a specific set of signals into the chip, and then compare the results of the output to see if there is no obvious mistake. Wafer was then cut into pieces of the chip, previously tested negative clearance goods, however this was abandoned.

The next step is chip clearance package, will be vulnerable to protect the chip into a kit. In addition to protection, the package has two functions - the bottom of the green chips and the substrate to provide the interface between the computer ( pin), the top of the metal roof is a heat sink and fan connections for chip cooling. Good chip package, is what we call the processor.

Was admitted to the next processor machines do further testing and grading - with a series of different frequencies but the chip is likely to come from the same wafer, but with this step, according to the quality of being graded into different frequency. Sometimes because of different market demand, manufacturers will be better quality standard chip into a relatively low frequency, so that there is between the overclocking room.

Good price marked is the final product you!